Description
Uses high-purity T2 copper/oxygen-free copper bare round wire as the base material. Through hot-dip tinning and continuous electroplating tinning processes, the surface is uniformly coated with a pure tin layer. The coating is bright, dense, and uniform in thickness, with no missed plating, no peeling, and no oxidation black spots. It is available in soft and hard states, and the specifications range from ultra-fine 0.2mm and 0.5mm to large-size industrial grade.



